flexible packaging structures for high pressure treatments

نویسندگان

مریم حبیبی

مهدی فرهودی

چکیده

this paper reviews the possible effects determined on polymeric food packaging films by the simultaneous application of pressure (p) and temperature (t) in high pressure pasteurization and sterilization treatments of packaged foodstuffs. both theoretical modeling and experimental issues are discussed. in fact reversible and irreversible effects that could occur in single film as well as in multilayer film structures have been reviewed and correlated to the variation of structure a land morphological properties of the polymeric materials, under p/t conditions relevant for the specific application. the structural changes of the amorphous and crystalline domains of polymer films could possibly occur in response to pressure and/or temperature conditions, which, in turn, result in detectable effects on properties of packaging materials. particular attention has been devoted to addressing issues like irreversible alter-action off functional (i.e., barrier to gases and water vapor, scalping and migration phenomena) and mechanic alprop-erties of the packaging materials in a relationship with a modification of degree of crystalline, aging of the amorphous phase, elimination of multilayer films, rubbery to glassy state transition promoted by pressure and plasticization induced by absorption of low molecular weight compounds. industrial relevance: high pressure processing (hpp) is steadily gaining's food presser vat ion method that preserves natural sensory and nutritional attributes of food with a minimal quality loss. in fact, packaged foods processed by using this technique maintain most of their original texture and nutritional qualities, additionally exhibiting an extended shelf-life. industrially, the selection of the proper polymeric materials as well as the packaging structure become extremely important when both high pressure and high temperature are employed for high pressure sterilization processes. in this context, an important issue that is relevant for industrial applications is to predict the possible effects of treat-mends on the structure and morphology of the materials which, in turn, can determine relevant effects on mechanical, functional (i.e., gas and vapor barrier properties) and aesthetic (e.g., see-through clarity) properties. in fact, modification of the crystalline level, density change of amorphous regions and possible hydrolysis phenomena could hamper the use of the packaging material for the hpp applications. moreover, multilayer flexible films can, in some cases, display delimitation phenomena leading to unacceptable midi fictions of the aspect as well as of the integrity of the packaging structure.

برای دانلود باید عضویت طلایی داشته باشید

برای دانلود متن کامل این مقاله و بیش از 32 میلیون مقاله دیگر ابتدا ثبت نام کنید

اگر عضو سایت هستید لطفا وارد حساب کاربری خود شوید

منابع مشابه

Micromachined Flexible Interconnect for Wafer Level Packaging

Wafer Level Packaging (WLP) of microelectronic circuitry, in which critical package elements are formed on the silicon wafer prior to dicing, has several advantages over conventional packaging techniques, such as one-step testability of multiple chips on a silicon wafer prior to dicing, and the possibility of high input-output (I/O) density. One of the critical elements of WLP is the interconne...

متن کامل

Packaging Mathematical Structures

This paper proposes generic design patterns to define and combine algebraic structures, using dependent records, coercions and type inference, inside the Coq system. This alternative to telescopes in particular allows multiple inheritance, maximal sharing of notations and theories, and automated structure inference. Our methodology is robust enough to support a hierarchy comprising a broad vari...

متن کامل

Electromagnetic Emission Analysis for IC Packaging Structures

The IC packaging EMC/SI/PI problems have been broadly attested while its electromagnetic emissions are becoming increasingly significant as the data rate of digital system continues increasing. This paper focuses on EM emission behaviors for IC packaging structures. It is found that packaging EMI demonstrates clearly low and high frequency behaviors. Both theoretical analysis based on the first...

متن کامل

Selection of High Strength Encapsulant for MEMS Devices Undergoing High Pressure Packaging

Deflection behavior of several encapsulant materials under uniform pressure was studied to determine the best encapsulant for MEMS device. Encapsulation is needed to protect movable parts of MEMS devices during high pressure transfer molded packaging process. The selected encapsulant material has to have surface deflection of less than 5 μm under 100 atm vertical loading. Deflection was simulat...

متن کامل

Multilayer, Flexible Food Packaging Structures: Design and Response of Plastic Films to Accelerated Ageing

The effect of accelerated ageing on the structure and properties of single, metallized and multilayer films used in food packaging was studied, by exposing specimens of the above films to repeated ageing cycles in a weatherometer, under the combined action of UV, humidity and heat. The investigated films were: biaxially oriented polypropylene film (BOPP), metallized BOPP film, polyethylene (PE)...

متن کامل

Identification and Analysis of the Migration of Primary Aromatic Amines from Flexible Food Packaging by High-performance Liquid Chromatography (HPLC)

Background and Objectives: Primary Aromatic Amines (PAAs) are contaminants that can migrate from food flexible packaging. The main origin of these compounds is polyurethane adhesives used in the laminating process of multilayer films. Residual aromatic di-isocyanates of the reaction of adhesive polymerization migrate into the food, and are hydrolyzed to PAAs by the moisture of food. 2,4- and 2,...

متن کامل

منابع من

با ذخیره ی این منبع در منابع من، دسترسی به آن را برای استفاده های بعدی آسان تر کنید


عنوان ژورنال:
علوم و فنون بسته بندی

جلد ۵، شماره ۱۹، صفحات ۰-۰

کلمات کلیدی

میزبانی شده توسط پلتفرم ابری doprax.com

copyright © 2015-2023